MATEC Electronics partners with one of the world’s well -known technology driver PCB manufacturer company Amphenol in order to support entire life-cycle of the projects from variety of Markets such as military-defence, aerospace and industrial fields. MATEC’s role begins from first design activity with design engineers, following "design for manufacturability” concept and prototyping to series production. New applications are often developed in partnership with customers to deliver optimum performance under extreme conditions. Unrivalled technical capabilities coupled with innovation and close customer/supplier relationship ensure a comprehensive service-backed offering.
MATEC’s engineering service team acts as advisory and checks all of the models from pre-design stage for manufacturability and production stage to supply most efficient solution in terms of cost and technology. After the design data has been fixed our standart lead times start from 10-15 days. We also support our customers catch their project deadlines with faster lead times in critical situation.
Our aim is to always focus on technology and focusing on solving most challenging problems or requirements. Our standart PCB production capability starts from standart from sinle layer boards to 40+ layered boards, in addition to Flex , Flex – Rigid solutions and HDI ( High Density Interconnect ) solutions. Our product and technology capabilities can be found in the table below.
Capability |
Standart 2013
Microns/Mils |
Advanced 2013
Microns/Mils |
Road Map
Microns/Mils |
|
Inner Layer |
Track
GAP |
50 microns - 2 mils
50 microns - 2 mils |
38 microns -1.5 mils
38 microns - 1.5 mils |
25 microns - 0.8 mils
25 microns - 0.8 mils |
Outer Layer |
Track
GAP |
75 microns - 3 mils
75 microns - 3 mils |
63 microns - 2.5 mils
63 microns - 2.5 mils |
50 microns - 2 mils
50 microns - 2 mils |
Laser via pads |
Internal Pads |
0.250 mm -10 mils
300 microns - 12 mils |
200 microns - 8 mils
225 microns - 9 mils |
|
Mechanical via pads |
External Pads
Internal Pads |
450 microns - 18 mils
500 microns - 20 mils |
350 microns - 14 mils
450 microns - 18 mils |
|
Aspect radio | 10:1 | 11:1 | 12:1 | |
Solder resist
solder mask clearence |
40 microns - 1.6 mils |
30 microns - 1.2 mils | 20 microns - 0.8 mils | |
Copper thickness |
Min
Max |
12 microns - 0.5 mils
210 microns - 9 mils |
9 microns - 0.4 mils
210 microns - 9 mils |
5 microns - 0.2 mils
>210 microns - 9 mils |
Min Dielectric thickness | 25 microns - 1 mils | 25 microns - 1 mils | <25 microns - 1 mils | |
HDI |
Min
Max |
1+N+1
5+N+5 |
1+N+1
6+N+6 |
1+N+1
>6+N+6 |
MAX panel size
Standard |
24"x21" / 609.6 mm x 533.4 mm
24"x18" / 609.6 mm x 457.2 mm |
24"x21" / 609.6 mm x 533.4 mm
24"x18" / 609.6 mm x 457.2 mm |
24"x21" / 609.6 mm x 533.4 mm
24"x18" / 609.6 mm x 457.2 mm |
|
Panel Thickness |
Min
Max |
0.03" / 0.08 mm
0.20"/5.00 mm |
0.016" / 0.04 mm
0.21" / 5.3 mm |
0.001" / 0.25 mm
>0.21" / 5.3 mm |
Max layer count | 40 | 50 | >50 | |
Mic mechanical hole
Buried pair mechanical
Min diameter laser via
Buried pair laser |
Min
Min
Min
Min
|
250 microns - 10 mils
150 microns - 6 mils
100 microns - 4 mils
70 microns - 2.8 mils |
200 microns - 8 mils
150 microns - 6 mils
75 microns - 3 mils
<70 microns - 2.8 mils |
200 microns - 8 mils
150 microns - 6 mils
75 microns - 3 mils
<70 microns - 2.8 mils |
Mechanical depth control | +/- | +/- 25 microns - 1 mils | +/- 15 microns - 0.6 mils | +/- 10 microns - 0.4 mils |
Control Impedance | % | +/- %10 | +/- %7 | > +/- %7 |