MATEC Electronics partners with one of the world’s well -known technology driver PCB manufacturer company Amphenol in order to support entire life-cycle of the projects from variety of Markets such as military-defence, aerospace and industrial fields. MATEC’s role begins from first design activity with design engineers, following "design for manufacturability” concept and prototyping to series production. New applications are often developed in partnership with customers to deliver optimum performance under extreme conditions. Unrivalled technical capabilities coupled with innovation and close customer/supplier relationship ensure a comprehensive service-backed offering.


MATEC’s engineering service team acts as advisory and checks all of the models from pre-design stage for manufacturability and production stage to supply most efficient solution in terms of cost and technology. After the design data has been fixed our standart lead times start from 10-15 days. We also support our customers catch their project deadlines with faster lead times in critical situation.


Our aim is to always focus on technology and focusing on solving most challenging problems or requirements. Our standart PCB production capability starts from standart from sinle layer boards to 40+ layered boards, in addition to Flex , Flex – Rigid solutions and HDI ( High Density Interconnect ) solutions. Our product and technology capabilities can be found in the table below.


Capability
Standart 2013
Microns/Mils
Advanced 2013
Microns/Mils
Road Map
Microns/Mils
Inner Layer
 Track
GAP
50 microns - 2 mils
 50 microns - 2 mils 
38 microns -1.5 mils
  38 microns - 1.5 mils 
25 microns - 0.8 mils
 25 microns - 0.8 mils 
Outer Layer
Track
GAP
75 microns - 3 mils
75 microns - 3 mils
63 microns - 2.5 mils
63 microns - 2.5 mils
50 microns - 2 mils
 50 microns - 2 mils 
Laser via pads

Internal Pads
0.250 mm -10 mils
300 microns - 12 mils
200 microns - 8 mils
225 microns - 9 mils

 Mechanical via pads
  External Pads  
Internal Pads
450 microns - 18 mils
500 microns - 20 mils
350 microns - 14 mils
450 microns - 18 mils

Aspect radio
10:1 11:1 12:1
Solder resist
solder mask clearence

40 microns - 1.6 mils
30 microns - 1.2 mils 20 microns - 0.8 mils
 Copper thickness
Min
Max 
12 microns - 0.5 mils
210 microns - 9 mils 
 9 microns - 0.4 mils
210 microns - 9 mils
5 microns - 0.2 mils
>210 microns - 9 mils 
   Min Dielectric thickness      25 microns - 1 mils  25 microns - 1 mils  <25 microns - 1 mils 
HDI 
Min
  Max  
1+N+1
 5+N+5 
 1+N+1
 6+N+6
 1+N+1
>6+N+6 
 MAX panel size
Standard
 
24"x21" / 609.6 mm x 533.4 mm
24"x18" / 609.6 mm x 457.2 mm
24"x21" / 609.6 mm x 533.4 mm
24"x18" / 609.6 mm x 457.2 mm
24"x21" / 609.6 mm x 533.4 mm
24"x18" / 609.6 mm x 457.2 mm
Panel Thickness 
Min
Max  
0.03" / 0.08 mm
0.20"/5.00 mm 
 0.016" / 0.04 mm
0.21" / 5.3 mm
0.001" / 0.25 mm
>0.21" / 5.3 mm 
 Max layer count    40  50 >50 
 Mic mechanical hole
Buried pair mechanical
Min diameter laser via
Buried pair laser
 Min
Min
Min
Min

 250 microns - 10 mils
150 microns - 6 mils
100 microns - 4 mils
70 microns - 2.8 mils
200 microns - 8 mils
150 microns - 6 mils
75 microns - 3 mils
<70 microns - 2.8 mils
200 microns - 8 mils
150 microns - 6 mils
75 microns - 3 mils
<70 microns - 2.8 mils 
 Mechanical depth control  +/- +/- 25 microns - 1 mils  +/- 15 microns - 0.6 mils  +/- 10 microns - 0.4 mils 
Control Impedance  % +/- %10 +/- %7 > +/- %7


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